Wire Bond Process Manager

Job description This rapidly expanding Semiconductor company in Malacca is seeking a Wire Bond Process Manager. Key Responsibilities:Perform process optimization to achieve the better wire bond yield and product quality as well as process robustness to meet the process Cpk.Hands on for recipe management system in consolidating the wire bond recipes by different die type, package type and design ID.Involved actively in solving wire bond related issues broken wires, lifted pad, slack wires, lifted stitch, IMC crack, bond pad crack) through 8D methodology.Responsible to characterize the package / process systematically to exceeding quality and reliability requirements.Responsible in understanding the key parameters definition and implement necessary control plan to achieve the 1st time right of process manufacturability.Proactively conduct process optimization and improvement during feasibility to low volume (safe launch) phase to ensure successful High-Volume Manufacturing.As process owner and responsible to derive corrective action whenever encounter any quality or technical issue in respect to the project.Skills & Experience Required:Masters/Bachelor's Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.Familiar with development of Power packages (PQFN, SO8FL, SOIC, TOLL etc.) an added advantage.Min 3 years working experience as Wire Bond process development / process engineer in Semiconductor Manufacturing environment.Good in critical thinking and systematic problem-solving skills DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bond, IS-IS NOT etc.Good written and verbal presentation skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings.