Package Development Staff Engineer

Package Development Staff Engineer

On Semiconductor Ssmp Phils. Corp.

Package Development Staff Engineer

Details of the offer

Initiates the qualification/productizationof new devices related to Dicing, DB, Clip Bond,andwirebondfor FOL and any processes atEOL
Work Experience: 5 year/s and 8 month/s
Salary: ?50,000 - ?50,000
Balikbayans/OFW Returnees

Source: Jora


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